发明名称 |
Parts packaging device and parts packaging method |
摘要 |
In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.
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申请公布号 |
US2006185157(A1) |
申请公布日期 |
2006.08.24 |
申请号 |
US20050549175 |
申请日期 |
2005.09.16 |
申请人 |
SHIDA SATOSHI;KANAYAMA SHINJI;ONOBORI SHUNJI;HIRATA SHUICHI;NAKAO MAMORU;OE KUNIO;KUGIHARA AKIRA;NARITA SHORIKI;ETOH YOSHITAKA;HAJI HIROSHI |
发明人 |
SHIDA SATOSHI;KANAYAMA SHINJI;ONOBORI SHUNJI;HIRATA SHUICHI;NAKAO MAMORU;OE KUNIO;KUGIHARA AKIRA;NARITA SHORIKI;ETOH YOSHITAKA;HAJI HIROSHI |
分类号 |
H05K3/34;B23P19/00;H01L21/00;H05K13/04 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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