发明名称 METHOD AND DEVICE FOR SEPARATING HEAD SLIDER
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for separating a head slider, simply constructed and capable of preventing the occurrence of residual of a solder material or the like on a flexure side when the head slider bonded by solder is separated from the flexure. SOLUTION: The method and the device for separating a head slider include the step of fixing a flexure having a head slider by a fixing means, the step of holding a head slider by using a slider holding means capable of moving while holding the head slider, the step of heating and melting a solder material part farthest from a slider electrode in the area of the solder material to cover a flexure electrode, the step of melting the solder material of an area bonded to the flexure electrode by heating the flexure electrode via the melted solder material part, and the step of holding the slider by the slider holding means to move after the solder part of the area bonded to the flexure electrode is melted, releasing a connected state between a slider electrode and the flexure electrode by the solder material, and separating the head slider from the flexure. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006221678(A) 申请公布日期 2006.08.24
申请号 JP20050031176 申请日期 2005.02.08
申请人 TDK CORP 发明人 TAKANUKI KAZUAKI;SHINDO OSAMU;ITOGA AKIRA;KANEKO MASAAKI;YAMAGUCHI SATORU
分类号 G11B21/26;G11B5/60;G11B21/21 主分类号 G11B21/26
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