| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cleaning method and a substrate cleaning device which can shorten a time required for drying a substrate to improve production efficiency of substrates. SOLUTION: While a wafer W is rotated with a rotation axis R as a center, hydrofluoric acid acting as a cleaning liquid is supplied from an upper nozzle 64 and a lower nozzle 14 to both faces Wa and Wb of the wafer W to clean the wafer W by the hydrofluoric acid. Then HFE is supplied as a rinse liquid from the upper nozzle 64 and the lower nozzle 14 to both the faces Wa and Wb of the wafer W as the rotation of the wafer W is kept, to start rinsing for the wafer W using the HFE (hydrofluoro ether), and the hydrofluoric acid on the surface of the wafer W is rinsed away. Then the wafer W is rotated more rapidly to shake off the rinse liquid on the surface of the wafer W and dry. As the cleaning liquid, it is desirable that organic acid such as oxalic acid and citric acid, etc. or organic alkali such as TMAH, etc. is used instead of the hydrofluoric acid. COPYRIGHT: (C)2006,JPO&NCIPI
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