发明名称 |
RADIO FRONT-END MODULE WITH PASSIVE CIRCUIT ELEMENTS MONOLITHICALLY INTEGRATED IN A SEMICONDUCTOR SUBSTRATE AND WITH AN INTEGRATED CIRCUIT CONNECTED TO SAID SUBSTRATE |
摘要 |
A highly integrated radio front-end module. In one embodiment a semiconductor substrate is processed with various circuit components in the substrate, as well as interconnections for the various circuit components, imbedding the circuit components into the substrate. One or more circuit components may be further connected with a separate integrated circuit, the separate integrated circuit bonded to the semiconductor substrate via contact points processed into the substrate. |
申请公布号 |
WO2005099110(A3) |
申请公布日期 |
2006.08.24 |
申请号 |
WO2005US10134 |
申请日期 |
2005.03.25 |
申请人 |
INTEL CORPORATION;KIPNIS, ISSY;RAO, VALLURI, R. |
发明人 |
KIPNIS, ISSY;RAO, VALLURI, R. |
分类号 |
H01L25/065;H01L25/16;H01L25/18;H04B1/18 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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