发明名称 |
Solid-state imaging device and method of manufacturing said solid-state imaging device |
摘要 |
It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.
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申请公布号 |
US2006186499(A1) |
申请公布日期 |
2006.08.24 |
申请号 |
US20060404898 |
申请日期 |
2006.04.17 |
申请人 |
MAEDA HIROSHI;NISHIDA KAZUHIRO;NEGISHI YOSHIHISA;HOSAKA SHUNICHI |
发明人 |
MAEDA HIROSHI;NISHIDA KAZUHIRO;NEGISHI YOSHIHISA;HOSAKA SHUNICHI |
分类号 |
H01L31/0232;H01L21/00;H01L27/148;H01L31/0203 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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