| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, CURED OBJECT AND METHOD FOR MANUFACTURING THE SAME, INSULATING PROTECTIVE COATING FILM, PHOTOSENSITIVE ELEMENT AND METHOD FOR MANUFACTURING THE SAME, RESIST PATTERN FORMING METHOD, AND PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of achieving sufficiently high sensitivity, tent reliability and adhesion when used in manufacturing a printed wiring board. <P>SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable unsaturated compound having an ethylenically unsaturated bond, (C) a photopolymerization initiator and (D) cerium compound-containing solid particles. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2006221096(A) |
申请公布日期 |
2006.08.24 |
| 申请号 |
JP20050036670 |
申请日期 |
2005.02.14 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
MURAKAMI TAIJI;SUSA KENZO;MACHII YOICHI |
| 分类号 |
G03F7/004;G03F7/40;H05K3/06 |
主分类号 |
G03F7/004 |
| 代理机构 |
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