发明名称 METHOD OF EVALUATING HEAT TREATMENT BOAT
摘要 PROBLEM TO BE SOLVED: To provide a method of evalauating a heat treatment boat capable of adequately determining an advisability of the heat treatment boat that holds a semiconductor substrate and introduces it to a heat-treating furnace in a small amount of time, and capable of improving a productivity of the semiconductor substrate that is heat treated. SOLUTION: The method that adequately determines the advisability of the heat treatment boat that holds a semiconductor substrate and introduces it to the heat-treating furnace determines the advisability of the heat-treatment boat depending on the number of a dislocation formed at a contact part for contacting the heat-treatment boat of the semiconductor substrate after holding the semiconductor substrate by the heat-treatment boat and introducing it to the heat-teating furnace. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006222266(A) 申请公布日期 2006.08.24
申请号 JP20050034247 申请日期 2005.02.10
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 AIHARA TAKESHI
分类号 H01L21/324;H01L21/22;H01L21/683 主分类号 H01L21/324
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