发明名称 PATTERNING METHOD, FILM FORMING METHOD, PATTERNING DEVICE, FILM FORMING DEVICE, ELECTRO-OPTIC DEVICE AND PRODUCTION METHOD THEREFOR, ELECTRONIC APPARATUS, AND ELECTRONIC DEVICE AND PRODUCTION METHOD THEREFOR
摘要 A new method for patterning in which a degree of flexibility in selection of materials is increased is provided and, in addition, a method for forming a film, a patterning apparatus, a film formation apparatus, an electro-optic apparatus and method for manufacturing the same, electronic equipment, and an electronic apparatus and method for manufacturing the same are provided. <??>A patterning apparatus 1 provided with a vacuum chamber 2 capable of being adjusted at a high degree of vacuum, a nozzle 3 connected to a material supply source 7 while being attached to the vacuum chamber 2 so as to supply a material from the material supply source 7 into the vacuum chamber 2, and a substrate stage 4 arranged in the vacuum chamber 2 so as to hold and fix a substrate S. The nozzle 3 or the substrate stage 4 is provided with a movement mechanism 11 for relatively moving positions thereof. <??>Ideally, it is desirable that a free jet of material molecules is generated, and patterning is performed using this free jet (free jet patterning). According to this, patterning can be performed with higher precision. <IMAGE>
申请公布号 EP1427262(A4) 申请公布日期 2006.08.23
申请号 EP20020765527 申请日期 2002.09.12
申请人 SEIKO EPSON CORPORATION 发明人 MIYAZAWA, TAKASHI
分类号 H05B33/10;B05C5/00;B05C9/08;B05C15/00;C23C14/04;H01L27/32;H01L51/00;H01L51/30;H01L51/40;H01L51/50;H05B33/14 主分类号 H05B33/10
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