METHOD FOR THE MOLECULAR BONDING OF MICROELECTRONIC COMPONENTS TO A POLYMER FILM

摘要

The molecular adhesion of a second electronic composite on to a first electronic composite (1), the contact surface of the first containing a polymer (4), comprises the coating by a linking layer (5) of at least a part of the polymer surface. The molecular adhesion takes place between the linking layer and the second electronic composite. An independent claim is also included for a three-dimensional matrix of electronic composites produced by this method of molecular adhesion.