SILICONE ADHESIVE AGENT

摘要

A silicone adhesive agent for joining a semiconductor pellet and a member for mounting said pellet, which comprises a addition reaction curing type silicone rubber composition exhibiting a stain onto a glass plate during curing by heating of a contact angle on the glass of 70° or less. The silicone adhesive agent does not lower the wire bondability and also does not lower the adhesion between the surface of a semiconductor pellet or a lead frame and a scaling resin.