发明名称 |
Thermally conductive elastomeric pad |
摘要 |
The present invention relates to thermally conductive, elastomeric pads. The pads can be made by injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.
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申请公布号 |
US7094822(B2) |
申请公布日期 |
2006.08.22 |
申请号 |
US20040870629 |
申请日期 |
2004.06.17 |
申请人 |
COOL SHIELD, INC. |
发明人 |
SAGAL E. MIKHAIL;MCCULLOUGH KEVIN A.;MILLER JAMES D. |
分类号 |
C08K3/00;B29C45/00;B29C70/58;H05K1/02;H05K3/28 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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