发明名称 Semiconductor device and manufacturing method thereof
摘要 A semiconductor device includes a substrate having first to fourth regions, a first insulating film formed on the substrate in the first region, a first epitaxial layer formed on the substrate in the second region and having an upper surface higher than an upper surface of the first insulating film, a first semiconductor layer formed on the first insulating film with a space provided with respect to the first epitaxial layer and having an upper surface set at substantially the same height as the upper surface of the first epitaxial layer, and an element isolation insulating film formed in the space and having an upper surface set at substantially the same height as the upper surface of the first epitaxial layer and the upper surface of the first semiconductor layer.
申请公布号 US7095081(B2) 申请公布日期 2006.08.22
申请号 US20060331316 申请日期 2006.01.13
申请人 发明人
分类号 H01L27/01;H01L21/76;H01L21/762;H01L21/8234;H01L21/8247;H01L21/84;H01L27/08;H01L27/088;H01L27/10;H01L27/115;H01L27/12;H01L29/00;H01L29/788;H01L29/792;H01L31/0392 主分类号 H01L27/01
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