| 摘要 |
A carrier assembly controls movement of a movable member within a mold tool to first receive a quantity of molten material, and then displace that molten material back into a mold cavity during solidification of a molded article. The moveable member moves relative to the surface of the mold cavity to compensate for local volume changes in a molded part that occur during solidification to substantially eliminate depressions and sink marks on an outer surface of a plastic injection molded part.
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