发明名称 Method for forming positive metal pattern and EMI filter using the same
摘要 A method for forming a positive metal pattern that includes the steps of (i) coating a photocatalytic compound on a substrate to form a photocatalytic film, (ii) coating a composition comprising a water-soluble polymer and a Pd compound on the photocatalytic film to form a photosensitive layer, (iii) selectively exposing the photocatalytic film and the photosensitive layer to light to form a latent pattern acting as a nucleus for crystal growth, and (iv) plating the latent pattern to grow a metal crystal thereon. Further disclosed is an electromagnetic interference (EMI) filter comprising a metal pattern formed by the method. According to the method, a high-resolution metal pattern can be formed in a rapid and efficient manner when compared to conventional methods for forming a metal pattern. In addition, since the EMI filter has superior performance and is easy to manufacture at low costs, it can be advantageously applied to flat display panels, including plasma display panels (PDPs).
申请公布号 US2006183061(A1) 申请公布日期 2006.08.17
申请号 US20060325339 申请日期 2006.01.05
申请人 SAMSUNG CORNING CO., LTD. 发明人 HWANG EUK C.;NOH CHANG H.;CHO SUNG H.;SONG KI Y.;KIM JIN Y.
分类号 G03F7/00 主分类号 G03F7/00
代理机构 代理人
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