| 摘要 |
A leadframe is disclosed having an unreduced leadframe thickness. The leadframe includes a portion of reduced thickness. The portion of reduced thickness can be created by a subtractive process, such as an etching process. The leadframe further includes a gap located within the portion of reduced thickness. The gap is located between metal portions of the leadframe and extends through at least a portion of the reduced thickness. The width of the gap can be less than the unreduced leadframe thickness as a result of the portion of reduced thickness. |
