| 发明名称 |
MULTI-FUNCTIONAL STRUCTURAL CIRCUITS |
| 摘要 |
A method and apparatus relating to a multifunctional, structural circuit, referred to as a structural circuit, are disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220). |
| 申请公布号 |
WO2006055164(A3) |
申请公布日期 |
2006.08.17 |
| 申请号 |
WO2005US37721 |
申请日期 |
2005.10.20 |
| 申请人 |
HARRIS CORPORATION |
发明人 |
SMITH, C. W. SINJIN;JAYNES, PAUL, B.;NEWTON, CHARLES, M. |
| 分类号 |
H01K3/22 |
主分类号 |
H01K3/22 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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