| 摘要 |
The present invention provides a heatsink structure with an air duct, which is utilized to dissipate heat from heat-generating elements. The heatsink structure comprises a heatsink module, an air duct, and a fan module, wherein the cooling wind generated by the fan module is guided through the air duct toward the heatsink module to dissipate the heat therefrom. Via the design of the air duct of the present invention, not only the fast assembling and disassembling of the heatsink module can be achieved, but the efficiency or the cost of the installing, maintaining and changing for upgrade of the CPU and the video chipset can also be promoted or reduced.
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