| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayered printed wiring board which is never reduced in connection reliability by forming a filled via immediately above a filled via having a small diameter. <P>SOLUTION: A filled via 60 formed on a lid plating layer 36a and 36d is applied with smaller stress than a filled via 160 formed in a second interlayer resin insulation layer 150 during heat cycle. For that reason, the bottom diameter d1 of the filled via 60 is made smaller than the bottom diameter d2 of the filled via 160 formed immediately above the filled via 60. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
