| 摘要 |
A method, system, and apparatus for a die frame, and for transferring integrated circuit dies therewith, is described. In one aspect for making a die frame, a wafer that comprises a plurality of dies is attached to a surface of a tape structure. A grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure. A portion of the tape structure that is accessible through the grooves of the grid is caused to harden into a grid shaped structure. The grid shaped structure removably holds the plurality of dies. One or more dies of the plurality of dies can be moved from the grid shaped structure onto a target surface. In an alternative aspect, when the grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure, the surface of the tape structure is breached in the grooves. The breach causes a hardening material encapsulated in the tape structure to be released and to harden in the grooves into a grid shaped hardened material.
|
