| 摘要 |
<P>PROBLEM TO BE SOLVED: To remarkably improve inspection accuracy in the inspection method/system that conduct image processing for each board for inspection after execution of at least the last process or two or more processes including the last process among multiple processes required for manufacturing mounted substrates. <P>SOLUTION: An inspection device 1 is arranged in every process in a mounted substrate manufacturing process. The inspection devices 1 interconnect with each other via a network line 2. Each inspection device 1 saves the inspection result, measured data and image data used for inspection in the memory each time before conducting inspection. In addition, each inspection device 1 (solder print inspection device 1B, mounted substrate inspection device 1C, post-reflow inspection device 1D) excluding the bare substrate inspection device 1A (first inspection device) receives the board inspection information saved by an inspection device 1 in the preceding process and then uses it for inspection. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
