| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method capable of forming resin layers to be thick, without causing deformations, cracks or separations of the resin layers in the manufacturing of electronic devices provided with a plurality of resin layers, and to provide the electronic device. SOLUTION: This for manufacturing the electronic device that is provided with a first insulating resin layer 11 provided on a substrate 1, a wiring layer 12 provided on the first insulating resin layer 11, and a second insulating resin layer provided on the first insulating resin layer 11 and the wiring layer 12. Prior to forming the second insulating resin layer, plasma treatment is applied to the surface of the first insulating resin layer 11. COPYRIGHT: (C)2006,JPO&NCIPI
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