THERMOSETTING DIELECTRIC RESIN COMPOSITION AND THERMOSETTING DIELECTRIC RESIN FILM

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting dielectric resin composition capable of readily preparing a thermosetting dielectric resin film having excellent handleability in an uncured state and flexibility in assembling operation efficiency into a substrate and sufficient reliability withstanding the use thereof after curing. SOLUTION: The thermosetting dielectric resin composition is used for preparing the thermosetting dielectric resin film having the flexibility in the uncured state. The thermosetting dielectric resin composition is characterized in that the composition comprises an epoxy resin A which is a solid state at normal temperature and a liquid epoxy resin B having≤10 Pa s viscosity at 25°C so as to provide (25:75) to (75:25) weight ratio (A:B) and dielectric ceramics are contained so as to provide 20-80 vol.% based on the sum of the epoxy resins A and B. COPYRIGHT: (C)2006,JPO&NCIPI