发明名称 PRE-INSULATING SUBSTRATE, METHOD OF MANUFACTURING SUBSTRATE, METHOD OF MANUFACTURING SURFACE ACOUSTIC WAVE VIBRATOR, SURFACE ACOUSTIC WAVE VIBRATOR, SURFACE ACOUSTIC WAVE DEVICE, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a pre-insulating substrate provided with a protective sheet having sufficient adhesive strength to treatment for rendering the substrate insulated, a method of manufacturing a substrate where only a desired range of a base surface is rendered insulated, a method of manufacturing a surface acoustic wave vibrator, the surface acoustic wave vibrator manufactured by the manufacturing method, a surface acoustic wave device, and electronic apparatus. SOLUTION: The method of manufacturing the substrate comprises: a step of giving a first functional liquid to a part of a conductive section of the surface of the base 11 and drying it for forming a first protection layer 31 having a peripheral partition part 33; a step of giving a second functional liquid to an area surrounded by the partition part and drying it for forming a second protection layer 32 to form a protective film 30 having the first protection layer 31 and the second protection layer 32 on the surface of the base 11; a step (b) applying treatment for rendering the substrate insulated to the surfaces of the base 11 and the pre-insulating substrate 12(a) having the protective film 30; and a step of peeling off the protective film 30. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006217309(A) 申请公布日期 2006.08.17
申请号 JP20050028574 申请日期 2005.02.04
申请人 SEIKO EPSON CORP 发明人 HASEI HIRONOBU
分类号 H03H3/08;C25D11/00;H01L21/316;H03H9/145 主分类号 H03H3/08
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