发明名称 |
Highly moisture-sensitive electronic device element and method for fabrication |
摘要 |
A highly moisture-sensitive element and method of making such element includes an encapsulation enclosure encapsulating all of the highly moisture-sensitive electronic devices on a substrate and a sealing material positioned between the substrate and the encapsulation enclosure to form a complete seal between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.
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申请公布号 |
US7091605(B2) |
申请公布日期 |
2006.08.15 |
申请号 |
US20010957851 |
申请日期 |
2001.09.21 |
申请人 |
EASTMAN KODAK COMPANY |
发明人 |
BOROSON MICHAEL L.;SCHMITTENDORF JOHN;SERBICKI JEFFREY P. |
分类号 |
G01N27/12;H01L23/34;B01D53/26;G02F1/13;H01L23/08;H01L23/10;H01L23/26;H01L51/52;H01L51/56 |
主分类号 |
G01N27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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