发明名称 DRAM cells and electronic systems
摘要 The invention includes capacitor constructions which have a layer of aluminum oxide between a high-k dielectric material and a layer containing titanium and nitrogen. The layer containing titanium and nitrogen can be, for example, titanium nitride and/or boron-doped titanium nitride. The capacitor constructions can be incorporated into DRAM cells, which in turn can be incorporated into electronic systems. The invention also includes methods of forming capacitor constructions.
申请公布号 US7092234(B2) 申请公布日期 2006.08.15
申请号 US20030442509 申请日期 2003.05.20
申请人 MICRON TECHNOLOGY, INC. 发明人 BASCERI CEM;GRAETTINGER THOMAS M.
分类号 H01G4/06;H01G4/008;H01G4/12;H01G4/228;H01G4/33;H01L21/02;H01L21/316;H01L21/8234;H01L21/8242;H01L23/522;H01L27/115 主分类号 H01G4/06
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