发明名称 Molded brassiere cup structure, has adherent material layer adhering to surface of bag cover layer based on appropriate position within two liner bodies via hot press molding, where cover layer is made of low thermal conductivity material
摘要 <p>The structure has a bag cover layer (232) made of a low thermal conductivity material and attached to a thin film surface of a stuffed bag (231). An adherent material layer (233) is arranged at a junction surface of the layer (232) and internal and external liner bodies (22, 21). The layer (233) adheres to a surface of the layer (232) according to an appropriate position within the bodies by using a hot press integral molding.</p>
申请公布号 FR2881624(A3) 申请公布日期 2006.08.11
申请号 FR20050050390 申请日期 2005.02.09
申请人 CHEN CHIN TANG 发明人 CHEN CHIN TANG
分类号 A41C3/14;A41C5/00 主分类号 A41C3/14
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