发明名称 COMPOSITION FOR FORMING LOW DIELETRIC FILM COMPRISING FULLERENES, LOW DIELECTRIC FILM USING THE COMPOSITION AND METHOD FOR FORMING THE LOW DIELECTRIC FILM
摘要 <p>A composition for forming a low-dielectric constant film comprising a substituted fullerene, a low-dielectric constant film formed from the composition, and a method for forming the low-dielectric constant film are provided. The low-dielectric constant film has superior mechanical properties, such as hardness and elastic modulus, and excellent thermal conductivity.</p>
申请公布号 KR20060090483(A) 申请公布日期 2006.08.11
申请号 KR20050011405 申请日期 2005.02.07
申请人 SAMSUNG CORNING CO., LTD. 发明人 SHIN, HYEON JIN;JEONG, HYUN DAM;SEON, JONG BAEK
分类号 H01B3/46 主分类号 H01B3/46
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