发明名称 HEAD ASSEMBLY FOR CHIP MOUNTER
摘要 Provided is a component mounter having a plurality of revolving nozzle spindles, which can simultaneously pick up and mount two or more electronic components. A head assembly for the component mounter includes: a base frame; a rotary housing rotatably mounted on the base frame and having spindle receiving holes vertically formed at regular intervals at the same radius from a center thereof; a plurality of nozzle spindles having lower ends to which nozzles for picking up electronic components are coupled, and received in the spindle receiving holes such that the plurality of nozzle spindles rotate on the same axis when the rotary housing rotates; a housing rotating mechanism rotating the rotary housing; and a nozzle lifting mechanism including a nozzle lift driving unit, and a clutch part that moves according to the operation of the nozzle lift driving unit and can simultaneously press down and lower the plurality of nozzle spindles.
申请公布号 KR20060090145(A) 申请公布日期 2006.08.10
申请号 KR20050038203 申请日期 2005.05.07
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 RICKETSON TOMMY HOWARD
分类号 H05K13/04 主分类号 H05K13/04
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