| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve interlayer adhesion strength, and hence to prevent problems of separation, or the like from occurring in reflow treatment, or the like, in a wiring board in a structure where a ceramic dielectric layer and a polymer material dielectric layer are laminated compositely. <P>SOLUTION: In the wiring board 1, a wiring lamination section 6 in which a dielectric layer and a conductive layer are laminated at least one main surface of a substrate core section 2 is formed, and the compound laminated section 6 in which the polymer material dielectric layer 3A, the conductive layer 4B, and a ceramic dielectric layer 5 are laminated in contact one another, in this order from the side of the substrate core section 2 is contained in the wiring laminated section 6. In the compositely laminated section 6, the conductive layer 4B has a cutout section 18 at the conductor side where the layer is cut out partially in the direction of the inside of a surface, the ceramic dielectric layer 5 has a cut-out section 16 at the ceramic side where the layer is cut out partially in the direction of the inside of the surface, and a communication cut-out section 21, where the ceramic side cut-out section 16 communicates with the conductor side cutout section 18 is formed. A polymer material constituting the polymer material dielectric layer 3A is filled at the communication cut-out section 21 so that it reaches the ceramic side cutout section 16 via the conductor side cut-out section 18. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
