| 摘要 |
PROBLEM TO BE SOLVED: To arrange a grinding quantity sensor reducing the area of a cutting margin part of a bar. SOLUTION: Slider forming parts 3a, 4a formed by laminating a plurality of films and being parts of a slider are mounted on a wafer making columns of one or more, in a wafer. the column has a plurality of slider forming parts 3a, 4a arranged in the direction of that an ABs forming plane G being a plane becoming a recording medium opposing plane of the slider is set at a side plane of a longitudinal direction of the column, and the cutting margin parts 4a, 4b provided between the slider forming parts 3a, 4a, at least either of the cutting margin parts is formed to the ABS forming plane G, and it has a resistance film 32a in which electric resistance is changed as grinding, the slider forming parts 3a, 4a being adjacent to the cutting margin part 4a having the resistance film 32a are connected electrically to the resistance film 32a by electrical connecting means 35a, 35b in which one end is provided between the resistance film 32a and it and the other end has vamps 31a, 31b extended in the direction of lamination facing to an upper plane of the lamination part of the wafer. COPYRIGHT: (C)2006,JPO&NCIPI
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