发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device having different gate lengths and gate widths and comprising a full silicide gate electrode. SOLUTION: The semiconductor device 100 comprises a semiconductor substrate 5, a first gate insulating film 51 formed on the semiconductor substrate, a second gate insulating film 52 formed on the semiconductor substrate, a first full silicide gate electrode 11 formed on the first gate insulating film, and a full silicide second gate electrode 12 formed on the second gate insulating film which occupies the surface of the semiconductor substrate in the area larger than the first gate electrode and is thinner than the first gate electrode. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006210555(A) 申请公布日期 2006.08.10
申请号 JP20050019293 申请日期 2005.01.27
申请人 TOSHIBA CORP 发明人 KINOSHITA ATSUHIRO;TSUCHIYA YOSHINORI;KOGA JUNJI
分类号 H01L21/8234;H01L21/28;H01L27/088;H01L29/41;H01L29/423;H01L29/49;H01L29/786 主分类号 H01L21/8234
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