| 摘要 |
PROBLEM TO BE SOLVED: To provide a method suitable for forming high solder bumps that are superior in height precision. SOLUTION: The method comprises a step of forming a resist layer 12 over an electrode 2 on a substrate 10 in which the electrode 2 is provided, a step of forming an opening 11 at a position, corresponding to the electrode 2 in the resist layer 12, a step of pressing and adhering a film 4 on the resist layer 12 where the opening 11 is formed, a step of forming an opening 40 in the film 4 which communicates with the opening 11 of the resist layer 12, a step of applying a flux in a recess, which consists of the opening 11 of the resist layer 12 and the opening 40 of the film 4 and in which an electrode 2 is exposed, a step of filling the recess with a molten solder, and a step of providing a solder bump 5A on the electrode 2 in the recess, by cooling and solidifying the molten solder. COPYRIGHT: (C)2006,JPO&NCIPI |
