| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device which does not cause insulation defect of a bonding electrode even if the spacing between bonding electrodes is narrow when it is miniaturized. SOLUTION: A plurality of kinds of optical semiconductor element arrays of different pitches can be mounted on the same housing by disposing two sets of array-like bonding electrodes in both sides in the longitudinal direction of the optical semiconductor element array. Versatility of the optical semiconductor device increases by making the two sets of array-like bonding electrodes differ in bonding electrode spacing. Furthermore, since the inside and the outside of the housing are electrically connected via a through-hole, insulation defect is not caused even if the electrode spacing is narrow. Since prescribed electrodes among one electrode and the other electrode come into contact with each other on a housing outside surface, insulation defect is hardly generated even between electrodes even if the electrode spacing is narrow, thus realizing proximity of the pitch of the electrodes. COPYRIGHT: (C)2006,JPO&NCIPI
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