| 摘要 |
PROBLEM TO BE SOLVED: To provide a multipattern wiring board with which a plating layer of constant thickness is coated on a signal wiring in each of wiring board regions. SOLUTION: In a multipattern wiring board 9, a plurality of wiring board regions 1 having a signal wiring 2, respectively, are arrayed into a matrix form, and the wiring board regions 1 are enclosed with a dummy region 3, with a common conductor 4 for plating formed in the dummy region 3 which is electrically connected to the signal wiring 2 of each of wiring board regions 1. A common conductor 9 for plating is electrically connected to the signal wiring 2, with a feeding conductor layer 6 or a ground conductor layer 5 in the wiring board region 1 in-between. COPYRIGHT: (C)2006,JPO&NCIPI
|
