| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-heating device which is superior in temperature uniformity. SOLUTION: In the wafer-heating device, one main surface of a soaking plate formed of ceramic is set as a wafer-loading side, an exothermic resistor divided into a plurality of blocks is provided in the inside, a power supply unit, to be connected electrically to the exothermic resistor, is provided on the other main surface, and a casing holds the soaking plate. The exothermic resistor block, divided into a plurality of sections, consists of a circular exothermic resistor block, arranged at the center of the surface on which the exothermic resistor is formed, two annular exothermic resistor blocks arranged concentrically on the outside, the outermost annular exothermic resistor block is divided in the radial direction. COPYRIGHT: (C)2006,JPO&NCIPI
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