| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for semiconductor device which is free from cracking in a wiring board formed of resin and has alleviated stress. <P>SOLUTION: The package for semiconductor device comprises the wiring board 2 formed of resin, a semiconductor device 1 flip-chip connected to the resin wiring board 2 via a solder bump 5, a high heat conductive cover mounted on the surface of the resin wiring board 2 to cover the semiconductor device 1 and is in contact with the upper surface of the semiconductor device 1 at a part thereof, and a connecting terminal (solder ball 7) provided at the backside of the resin wiring board 2 and is electrically connected with the semiconductor device 1. In the package for semiconductor device, an recess is provided in the area of 50% or more of the bonding area at the almost center of the bonding surface with the semiconductor device in the high heat conductive cover, and this recess is filled with the high heat conductive resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
