| 摘要 |
PROBLEM TO BE SOLVED: To make a multilayer printed board light-weight multilayered one by making an insulation resin layer thin without causing the deformation by interlayer connection conductors, and increase the interlayer connection reliability by a simple structure in the multilayer printed board and its manufacturing method. SOLUTION: The multilayer printed board 1 is made by stacking a plurality of resin sheets 3 which are formed of thermoplastic resin and are each formed with a conductor pattern 2 consisting of a metal foil on one surface, and has, in via holes 4 formed in the resin sheets 3, the interlayer connection conductors 5 for electrically connecting the conductor patterns 2 belonging to the individual resin sheets 3 which are stacked adjacently to each other. The thickness (d) of the resin sheets 3 constituting the multilayer printed board 1 is 200μm or less, and the interlayer connection conductors 5 each contain a metal different from the metal foil which constitutes the conductor patterns 2 by 50 wt.% or above of the interlayer connection conductor 5. At least part of the metal different from the metal foil forms an alloy with the metal which constitutes the metal foil. COPYRIGHT: (C)2006,JPO&NCIPI |
