| 摘要 |
Supports ( 40 ) of microelectronic devices ( 10 ) are provided with underfill apertures ( 60 ) which facilitate filling underfill gaps ( 70 ) with underfill material ( 74 ). The underfill aperture may have a longer first dimension ( 62 ) and a shorter second dimension ( 64 ). In some embodiments, a method of filling the underfill gap ( 70 ) employs a removable stencil ( 80 ). If so desired, a stencil ( 80 ) can be used to fill multiple underfill gaps through multiple underfill apertures in a single pass.
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