| 发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
<p>A semiconductor device comprises a first (3A) and a second (3B) wiring on an insulation film (2) formed on the front surface of a semiconductor chip (1), a supporting body (4) having an opening (12) and a third wiring (9) on an additional insulation film (7) on a back surface of the chip. The opening exposes at least part of the second wiring. The third wiring extends along a side surface of the chip and connected to the first wiring. An independent claim is included for the production of the semiconductor device.</p> |
| 申请公布号 |
KR20060088518(A) |
申请公布日期 |
2006.08.04 |
| 申请号 |
KR20060059179 |
申请日期 |
2006.06.29 |
| 申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
NOMA TAKASHI;SUZUKI AKIRA;SHINOGI HIROYUKI |
| 分类号 |
H01L23/12;H01L23/50;H01L21/60;H01L21/768;H01L23/31;H01L23/48;H01L23/485;H01L25/065;H01L27/148 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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