LASER BEAM MACHINING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a laser punching machining method for preventing deterioration of machining quality.

SOLUTION: An object of machining is a wafer W having a structure where copper layers 4 are laminated on a resin layer 3. A plurality of window holes 4a which pass through the copper layers 4 and from which a surface of the resin layer 3 is exposed are formed on the copper layers 4. A unit processing is repeated for a plurality of cycles by making the unit processing for making an infrared pulse laser beam incident on the respective window holes 4a arranged in a scanning possible region 21 by a galvano scanner 14 by one shot by one as one cycle. When the window holes 4a are noticed, the galvano scanner 14 is controlled so that a center of an irradiation spot of the infrared pulse laser beam which is made incident on the window hole 4a is arranged in a different position between the cycles.

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