| 摘要 |
PROBLEM TO BE SOLVED: To flatten the surface of a thick film dielectric layer of an EL element without involving, in contrast to existing techniques, the formation of a flattening layer, the addition of hydrostatic press and other processes for the thick film dielectric layer, and an increase in materials used. SOLUTION: A first electrode layer 3A, the thick film dielectric layer 4, a luminescent layer 5 and a second electrode layer 3B are laminated in order on a substrate 2, and the mean grain size of dielectric powder forming the thick film dielectric layer 4 is set at not larger than 0.3μm. The thick film dielectric layer 4 may have a two-layer structure whose lower layer dielectric powder has a larger mean grain size. The standard of surface irregularities of the thick film dielectric layer 4 may be replaced with the standard of glossiness to provide preferable flatness and easy control. COPYRIGHT: (C)2006,JPO&NCIPI
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