SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

The thickness and occupied area are reduced compared with conventional methods when semiconductor chips are three-dimensionally arranged, low-cost mounting is realized without using any other components, and the manufacturing process of the semiconductor device is simplified. A flip-chip mounting structure in which a first semiconductor chip (101) thinned by back-grinding and a substrate (105) are directly connected to a wiring pattern (106) through bump electrodes (102) is fabricated. For example, an electrode (104) higher than the sum of the thickness of the first semiconductor chip (101) and the electrode (102) is formed on a second semiconductor chip (103) and connected directly to the wiring pattern (106) on the substrate (105), thus providing a most-compact, three-dimensional semiconductor mounted device.