发明名称 SENSOR CHIP
摘要 <P>PROBLEM TO BE SOLVED: To provide a sensor chip capable of coping even with measurement in a small quantity of sample, without causing variations in the characteristics of the sensor chip, even if there are variations in this dislocation between the sensor chips, by superposing both grooves at a position dislocated by more than a predetermined value, in the sensor chip manufactured by forming a hollow reaction part for applying a chemical to one wall surface by superposing both grooves, by laminating a plate having a corresponding groove on it, by applying the chemical to the groove of the plate that has the groove. <P>SOLUTION: This sensor chip is provided by laminating a plate A, having a groove A of applying the chemical and a plate B having a groove B to form the hollow reaction part by jointing the groove A and the groove B, and is characterized in that an opening width of the groove B is larger than the opening width of the groove A in a part facing a part applied with the chemical inside at least the groove A. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006201143(A) 申请公布日期 2006.08.03
申请号 JP20050016168 申请日期 2005.01.24
申请人 SUMITOMO ELECTRIC IND LTD;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY 发明人 KAIMORI SHINGO;HOSOYA TOSHIFUMI;ICHINO MORIYASU;NAKAMURA HIDEAKI;GOTO MASAO;KURUSU FUMIYO;ISHIKAWA TOMOKO;KARUBE MASAO
分类号 G01N27/28;G01N27/327;G01N27/416 主分类号 G01N27/28
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