| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board for a semiconductor package which has the thermal expansion coefficient similar to that of a silicon chip and is excellent in electrical connection reliability with the silicon chip when it is mounted. SOLUTION: The multilyer printed wiring board for a semiconductor package uses a dried pre-preg obtained by making a base material impregnated with epoxy resin composition. A woven cloth consisting of organic fiber having a negative value as thermal expansion coefficient is used as the base material of pre-preg. COPYRIGHT: (C)2006,JPO&NCIPI
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