HIGHLY RELIABLE SEMICONDUCTOR PACKAGE AND PACKAGING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To prolong a thermal fatigue life of a solder junction. SOLUTION: Making a round land an irregular shape replaces an occurrence of maximum distortion at a point with an occurrence of maximum distortion in a linear form, and slackens a change in distortion distribution to reduce the maximum distortion. This can prolong the fatigue life. COPYRIGHT: (C)2006,JPO&NCIPI