CONDUCTIVE ADHESIVE AND CONDUCTIVE PART AND ELECTRONIC PART MODULE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a conductive adhesive carrying out solder joining for packaging of a modularized part or another electronic part at a low temperature and collectively improving both conductivity of circuit connection by the solder joining and joining strength with the adhesive. SOLUTION: (1) The conductive adhesive is obtained by mixing an epoxy adhesive having flux actions with SnBi solder powder. (2) The conductive adhesive is (1) the conductive adhesive in which the epoxy resin having the flux actions is a flux for soldering containing at least an epoxy resin, a curing agent and an organic acid and the SnBi solder powder is lead-free solder powder having 150-170°C melting point. (3) The electroconductive adhesive is (2) the conductive adhesive in which the organic acid is a dibasic acid having an alkyl group in the side chain. COPYRIGHT: (C)2006,JPO&NCIPI