| 摘要 |
<p>A cooling treatment device, comprising a warpage measuring part measuring the warpage of a wafer. A plurality of suction and discharge ports capable of selectively sucking and discharging a gas are formed in the front surface of a cooling plate. The first suction and discharge port is formed in the surface of the cooling plate at a position corresponding to the center part of the wafer, and the second suction and discharge port is formed at a position corresponding to the outer peripheral part of the wafer. Based on the results of measurements of the warpage of the wafer by the warpage measuring part, a device control part selects the suctions or discharges of the first suction and discharge port and the second suction and discharge port, and maintains flat the water cooled by the cooling plate by a pressing force by blowing or a sucking force.</p> |
