| 摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive tape having high adhesion strength and resistant to the variation of the insulation properties and conductive properties even after the exposure to wet heat conditions and provide an anisotropic conductive bonded circuit board produced by using the adhesive tape. SOLUTION: The anisotropic conductive adhesive tape is produced by casting a coating liquid containing (A) a radically polymerizable acrylic binder resin having a specific weight-average molecular weight and a specific glass transition temperature, (B) a silane coupling agent, (C) a polymerization initiator and (D) a conductive filler. Aβ-dikenone structure capable of forming a 6-membered ring structure together with a metal in the adherend is formed in the adhesive layer of the anisotropic conductive adhesive tape. The anisotropic conductive bonded circuit board is produced by the anisotropic conductive bonding of two circuit boards with the anisotropic conductive adhesive tape. COPYRIGHT: (C)2006,JPO&NCIPI
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