发明名称 |
Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly |
摘要 |
An apparatus for conductive heat transfer for electrical devices from the solder side of a circuit card assembly can significantly reduce the component temperature, thereby maintaining the electrical device below its thermal limit. The apparatus comprises a thermally conductive member mountable on an opposite face of a circuit board from a face of the circuit board on which an electrical component is mounted, the thermally conductive member operable to conduct heat generated by the electrical component away from the electrical component.
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申请公布号 |
US2006171118(A1) |
申请公布日期 |
2006.08.03 |
申请号 |
US20050048901 |
申请日期 |
2005.02.03 |
申请人 |
FUJITSU NETWORK COMMUNICATIONS, INC. |
发明人 |
PEDOEEM ALBERT;YUAN LANG;BRAUN WILLIE |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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