SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING THE SAME

摘要

A semiconductor package (22, 27) is produced by assembling a composite wafer (1) comprising of alternately a first strip (2) including a plurality of first dies (6; 30) and a second strip (3) including a plurality of second dies (8; 31) on an adhesive tape (4). After the first dies (6; 30) are singulated from the first strips (2) and the second dies (8; 31) are sin-gulated from the second strips (3), a bond wire (11) is formed between a first die (6; 30) and a second die (8; 31) to form a component (9). The plurality of components (9) are embedded in mold compound (20) to form a panel (21). The components (9) are then separated from the panel (21) to form semiconductor packages (22, 27).